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Silicone Potting Compound 029 (Thermally Conductive). This two-component material provides effective thermal conductivity (2 W/mK) and long-lasting protection against moisture, dust, and vibrations. Its easy-to-apply formula forms a hard, chemical-resistant coating that withstands high temperatures. Thanks to its high dielectric strength (>20 kV/mm), it is ideally suited for use in power supply electronics, controllers, and automotive systems.
Silicone Potting Compound 029 offers a wide range of benefits that make it indispensable in electronic applications. With its condensation-curing mechanism, this compound forms a solid, durable rubber, providing excellent protection and 2 W/mK heat conductivity. Once cured, it forms a dry, flexible coating with a hardness of 63 on the Shore A scale. With a viscosity of 1,455 cP and excellent fluidity before curing, the product easily fills even the smallest gaps and complex structures.
This potting compound is used across various industries where both effective heat management and environmental protection are critical. Examples include:
- Sealing electronic and electrical systems: The compound provides protection against moisture, dust, vibrations, and other threats that could shorten the lifespan of systems.
- Protecting power semiconductors and energy converters: With its excellent heat conductivity, the product is ideal for systems operating under high loads.
- Automotive electronics: It safeguards control and power systems in vehicles from extreme temperatures and vibrations.
- Telecommunications and IT: It protects against overheating and mechanical damage in telecommunication devices and computer equipment.
The application of Silicone Potting Compound 029 is straightforward but requires following a few steps to ensure optimal system protection.
- Surface Preparation: Before starting the potting process, clean, degrease, and dry the electronic system. This crucial step ensures optimal adhesion and the effectiveness of the material’s protection.
- Mixing the Components: The compound consists of two components—silicone base material and catalyst—that need to be thoroughly mixed in the correct proportions. Mixing can be done manually or mechanically, depending on the batch size, to achieve a homogeneous composition.
- Air Removal: To avoid air bubbles, it is recommended to remove air from the mixture using a vacuum chamber. This step ensures the material will cure uniformly, without unwanted voids, improving its mechanical and thermal properties.
- Application and Curing: After preparing the mixture, apply it precisely to the system. It is important to leave the system open after application to allow condensation products like ethanol to evaporate. Curing at room temperature takes about 100 hours.
Features:
- Thermal conductivity: ~2 W/mK
- Protects against moisture, dust, and external factors
- Dry to the touch after curing
- Does not detach from surfaces due to cyclic heating
- Easy to apply with even distribution
- Safe formula for delicate electronic surfaces
Specifications:
- Physicochemical properties (A & B):
- Appearance: Gray liquid paste (A), Clear liquid (B)
- Density at 25°C: 1.15 g/cm3 (A), 0.94 g/cm3 (B)
- Viscosity at 25°C:1455 cP (A), 0.53 cP (B)
- pH value: >7 (A)
- Shelf life: 12 months
- Mixture properties, 100:10, (A+B)
- Density at 25°C: 1,15g/cm3
- Volatile content: 3%
- Working time at 25°C: 30 minutes
- Curing time at 25°C: Max. 60h
- Mixture properties after 100h curing:
- Consistency: Grey solid rubber
- Thermal conductivity: 2 W/mK
- Operating temperature range: -50...180°C
- Volume resistivity at 20±5°C and 65±5% RH (ASTM D257): 3.61 x 1015 ? x cm
- Surface resistivity at 20±5°C and 65±5% RH (ASTM D257): 1.75 x1015 ?
- Dielectric strength (20-25°C, 65% RH) (PN-EN 60243-1): >20.0 kV/mm
- Dielectric loss factor tg ? (ASTM D150): 0.005 (106 Hz)
- Relative dielectric permeability ?r (ASTM D150): 3 (106Hz)
- Tracking resistance (PN-EN 60112:2003): 600 CTI [V]
- Content: 1 kg (can)
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